- High thermal conductivity
- High dielectric constant
- High dissipation factor
- Use with heat sinks or metal chassis
- Will not dry or harden
- Contains zincs oxides and polydimenthyl siloxane
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Available Size：
|
Model
|
Available size
|
Description
|
|
860-60G
|
60 gram (2 oz)
|
jar
|
|
860-150G
|
150 gram (5 oz)
|
tube
|
